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FusionAP
Founded in 2025, FusionAP is a Malaysia‑based advanced packaging company specializing in next‑generation semiconductor packaging technologies. Working closely with a global ecosystem of design houses, foundries, and technology partners, FusionAP enables 2.5D, 3D, and future‑ready packaging solutions. From early prototyping through high‑volume production, FusionAP delivers a trusted, geopolitically neutral OSAT solution for advanced packaging innovation.
Visit websiteCEO:Teng Chow Ooi
Founders:Teng Chow Ooi,Peter Chavart
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